Polylithic integration using fused-silica stitch-chips for RF/mm-wave systems: simulation, fabrication, and characterization
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Zheng, Ting
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Abstract
Wireless technology such as 5G is driving innovations in the packaging for RF/mm-wave systems currently. Ultra-low-loss and impedance-matched package interconnects that can enable dense polylithic integration are critical for these RF/mm-wave systems.
A polylithic integration technology enabled by fused-silica stitch-chips is proposed in this dissertation to replace conventional wire-bonds or ribbon-bonds to reduce package loss. RF characterization and parasitic extraction are performed for interconnect components on the stitch-chip, including coplanar waveguide (CPW) and compressible microinterconnect (CMI). The stitch-chip impedance design is then investigated for embedded commercial off-the-shelf (COTS) monolithic microwave integrated circuit (MMIC) dice. Furthermore, such integration technology is demonstrated with active MMIC dice (e.g., low noise amplifier (LNA) die) as a single-chip module and a multi-chip module, which is elaborated in terms of its RF performance and thermal evaluation in this dissertation. The demonstration suggests a significant insertion loss reduction (4.4 dB) and lower signal reflection (>10 dB return loss) are achieved by utilizing the stitch-chips, compared with a similar wire-bonded module. In addition, alternative off-chip I/O technologies (e.g., microbump and hybrid-bond) are studied and benchmarked in terms of parasitics for polylithic integration.
In general, this dissertation is a complete study of the proposed polylithic integration technology using fused-silica stitch-chips, including simulation/design, fabrication, and RF characterization.
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Date
2023-07-26
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Dissertation