Title:
Lead-free Bonding Systems

dc.contributor.patentcreator Aggarwal, Ankur
dc.contributor.patentcreator Abothu, Isaac R.
dc.contributor.patentcreator Raj, Pulugurtha Markondeya
dc.contributor.patentcreator Tummala, Rao R.
dc.date.accessioned 2017-05-12T14:28:40Z
dc.date.available 2017-05-12T14:28:40Z
dc.date.filed 5/26/2005
dc.date.issued 7/7/2009
dc.description.abstract Nano-structured interconnect formation and a reworkable bonding process using solder films. Large area fabrication of nano-structured interconnects is demonstrated at a very fine pitch. This technology can be used for pushing the limits of current flip chip bonding in terms of pitch, number of I/Os, superior combination of electrical and mechanical properties as well as reworkability. Sol-gel and electroless processes were developed to demonstrate film bonding interfaces between metallic pads and nano interconnects. Solution-derived nano-solder technology is an attractive low-cost method for several applications such as MEMS hermetic packaging, compliant interconnect bonding and bump-less nano-interconnects.
dc.description.assignee Georgia Tech Research Corporation
dc.identifier.cpc H01L21/2885
dc.identifier.cpc H01L21/76885
dc.identifier.cpc H01L24/11
dc.identifier.patentapplicationnumber 11/138011
dc.identifier.patentnumber 7556189
dc.identifier.uri http://hdl.handle.net/1853/57806
dc.identifier.uspc 228/120
dc.title Lead-free Bonding Systems
dc.type Text
dc.type.genre Patent
dspace.entity.type Publication
local.contributor.corporatename Georgia Institute of Technology
local.relation.ispartofseries Georgia Tech Patents
relation.isOrgUnitOfPublication cc30e153-7a64-4ae2-9b1d-5436686785e3
relation.isSeriesOfPublication 0f49c79d-4efb-4bd9-b060-5c7f9191b9da
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