Title:
Lead-free Bonding Systems
Lead-free Bonding Systems
dc.contributor.patentcreator | Aggarwal, Ankur | |
dc.contributor.patentcreator | Abothu, Isaac R. | |
dc.contributor.patentcreator | Raj, Pulugurtha Markondeya | |
dc.contributor.patentcreator | Tummala, Rao R. | |
dc.date.accessioned | 2017-05-12T14:28:40Z | |
dc.date.available | 2017-05-12T14:28:40Z | |
dc.date.filed | 5/26/2005 | |
dc.date.issued | 7/7/2009 | |
dc.description.abstract | Nano-structured interconnect formation and a reworkable bonding process using solder films. Large area fabrication of nano-structured interconnects is demonstrated at a very fine pitch. This technology can be used for pushing the limits of current flip chip bonding in terms of pitch, number of I/Os, superior combination of electrical and mechanical properties as well as reworkability. Sol-gel and electroless processes were developed to demonstrate film bonding interfaces between metallic pads and nano interconnects. Solution-derived nano-solder technology is an attractive low-cost method for several applications such as MEMS hermetic packaging, compliant interconnect bonding and bump-less nano-interconnects. | |
dc.description.assignee | Georgia Tech Research Corporation | |
dc.identifier.cpc | H01L21/2885 | |
dc.identifier.cpc | H01L21/76885 | |
dc.identifier.cpc | H01L24/11 | |
dc.identifier.patentapplicationnumber | 11/138011 | |
dc.identifier.patentnumber | 7556189 | |
dc.identifier.uri | http://hdl.handle.net/1853/57806 | |
dc.identifier.uspc | 228/120 | |
dc.title | Lead-free Bonding Systems | |
dc.type | Text | |
dc.type.genre | Patent | |
dspace.entity.type | Publication | |
local.contributor.corporatename | Georgia Institute of Technology | |
local.relation.ispartofseries | Georgia Tech Patents | |
relation.isOrgUnitOfPublication | cc30e153-7a64-4ae2-9b1d-5436686785e3 | |
relation.isSeriesOfPublication | 0f49c79d-4efb-4bd9-b060-5c7f9191b9da |
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