Effective Elastic Modulus of Underfill Material for Flip-Chip Applications
Author(s)
Qu, Jianmin
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Abstract
In this paper, a micromechanics model based on the Mori–Tanaka method was developed to estimate the elastic modulus of underfill materials. An explicit expression of the underfill modulus was derived as a function of filler content and the properties of the matrix and the fillers. Predictions of the modulus from
this theory were compared with experimentally measured values.
Excellent agreement was observed.
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Date
2000-03
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