Title:
High yield flip chip processing and failure mode analysis for surface mount applications
High yield flip chip processing and failure mode analysis for surface mount applications
Author(s)
Tsai, Wen-Kai Mike
Advisor(s)
Baldwin, Daniel F.
Editor(s)
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Abstract
Sponsor
Date Issued
2000-08
Extent
Resource Type
Text
Resource Subtype
Thesis
Rights Statement
Access restricted to authorized Georgia Tech users only.