Title:
A New Temperature Distribution Measurement Method on GPU Architectures Using Thermocouples
A New Temperature Distribution Measurement Method on GPU Architectures Using Thermocouples
| dc.contributor.author | Dasgupta, Aniruddha | |
| dc.contributor.author | Hong, Sunpyo | |
| dc.contributor.author | Kim, Hyesoon | |
| dc.contributor.author | Park, Jinil | |
| dc.contributor.corporatename | Georgia Institute of Technology. College of Computing | en_US |
| dc.contributor.corporatename | Georgia Institute of Technology. Center for Experimental Research in Computer Systems | en_US |
| dc.contributor.corporatename | Georgia Institute of Technology. School of Computer Science | en_US |
| dc.contributor.corporatename | Georgia Institute of Technology. School of Electrical and Computer Engineering | en_US |
| dc.contributor.corporatename | Ajou University (Korea). School of Mechanical Engineering | en_US |
| dc.date.accessioned | 2013-10-21T23:35:16Z | |
| dc.date.available | 2013-10-21T23:35:16Z | |
| dc.date.issued | 2012 | |
| dc.description.abstract | In recent years, the many-core architecture has seen a rapid increase in the number of on-chip cores with a much slower increase in die area. This has led to very high power densities in the chip. Hence, in addition to power, temperature has become a first-order design constraint for high-performance architectures. However, measuring temperature is very limited to on-chip temperature sensors, which might not always be available to researchers. In this paper, we propose a new temperature-measurement system using thermocouples for many-core GPU architectures and devise a new method to control GPU scheduling. This system gives us a temperature distribution heatmap of the chip. In addition to monitoring temperature distribution, our system also does run-time power consumption monitoring. The results show that there is a strong corelation between the on-chip heatmap patterns and power consumption. Furthermore, we provide actual experimental results that show the relationship between TPC utilizations and their active locations that reduce temperature and power consumption. | en_US |
| dc.embargo.terms | null | en_US |
| dc.identifier.uri | http://hdl.handle.net/1853/49241 | |
| dc.language.iso | en_US | en_US |
| dc.publisher | Georgia Institute of Technology | en_US |
| dc.relation.ispartofseries | CERCS ; GIT-CERCS-12-06 | en_US |
| dc.subject | GPU | en_US |
| dc.subject | Many-core architecture | en_US |
| dc.subject | Temperature measurement | en_US |
| dc.subject | Thermocouple | en_US |
| dc.title | A New Temperature Distribution Measurement Method on GPU Architectures Using Thermocouples | en_US |
| dc.type | Text | |
| dc.type.genre | Technical Report | |
| dspace.entity.type | Publication | |
| local.contributor.author | Kim, Hyesoon | |
| local.contributor.corporatename | Center for Experimental Research in Computer Systems | |
| local.relation.ispartofseries | CERCS Technical Report Series | |
| relation.isAuthorOfPublication | ec222ec7-e853-445c-b356-51b942d36799 | |
| relation.isOrgUnitOfPublication | 1dd858c0-be27-47fd-873d-208407cf0794 | |
| relation.isSeriesOfPublication | bc21f6b3-4b86-4b92-8b66-d65d59e12c54 |