Title:
No-flow Underfill Of Epoxy Resin, Anhydride, Fluxing Agent And Surfactant
No-flow Underfill Of Epoxy Resin, Anhydride, Fluxing Agent And Surfactant
| dc.contributor.patentcreator | Wong, Ching-ping | |
| dc.contributor.patentcreator | Shi, Song-hua | |
| dc.date.accessioned | 2017-05-12T14:27:37Z | |
| dc.date.available | 2017-05-12T14:27:37Z | |
| dc.date.filed | 2/18/1998 | |
| dc.date.issued | 1/30/2001 | |
| dc.description.abstract | An epoxy material suitable for no-flow underfilling processes with high glass transition temperature can be obtained by curing a solvent free formulation containing an epoxy resin, an organic carboxylic acid anhydride hardener, a curing accelerator, a fluxing agent, a viscosity controlling agent, a coupling agent, and a surfactant. | |
| dc.description.assignee | Georgia Tech Research Corporation | |
| dc.identifier.cpc | C08G59/42 | |
| dc.identifier.cpc | C08G59/68 | |
| dc.identifier.cpc | C08L63/00 | |
| dc.identifier.patentapplicationnumber | 09/025532 | |
| dc.identifier.patentnumber | 6180696 | |
| dc.identifier.uri | http://hdl.handle.net/1853/57373 | |
| dc.identifier.uspc | 523/457 | |
| dc.title | No-flow Underfill Of Epoxy Resin, Anhydride, Fluxing Agent And Surfactant | |
| dc.type | Text | |
| dc.type.genre | Patent | |
| dspace.entity.type | Publication | |
| local.contributor.corporatename | Georgia Institute of Technology | |
| local.relation.ispartofseries | Georgia Tech Patents | |
| relation.isOrgUnitOfPublication | cc30e153-7a64-4ae2-9b1d-5436686785e3 | |
| relation.isSeriesOfPublication | 0f49c79d-4efb-4bd9-b060-5c7f9191b9da |
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