Title:
No-flow Underfill Of Epoxy Resin, Anhydride, Fluxing Agent And Surfactant
No-flow Underfill Of Epoxy Resin, Anhydride, Fluxing Agent And Surfactant
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Abstract
An epoxy material suitable for no-flow underfilling processes with high glass transition temperature can be obtained by curing a solvent free formulation containing an epoxy resin, an organic carboxylic acid anhydride hardener, a curing accelerator, a fluxing agent, a viscosity controlling agent, a coupling agent, and a surfactant.
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1/30/2001
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Patent