Title:
Power delivery and thermal considerations for 2.5-D and 3-D integration technologies
Power delivery and thermal considerations for 2.5-D and 3-D integration technologies
| dc.contributor.advisor | Bakir, Muhannad S. | |
| dc.contributor.author | Hossen, Md Obaidul | |
| dc.contributor.committeeMember | Naeemi, Azad | |
| dc.contributor.committeeMember | Raychowdhury, Arijit | |
| dc.contributor.committeeMember | Krishna, Tushar | |
| dc.contributor.committeeMember | Joshi, Yogendra | |
| dc.contributor.department | Electrical and Computer Engineering | |
| dc.date.accessioned | 2020-01-14T14:48:38Z | |
| dc.date.available | 2020-01-14T14:48:38Z | |
| dc.date.created | 2019-12 | |
| dc.date.issued | 2019-11-08 | |
| dc.date.submitted | December 2019 | |
| dc.date.updated | 2020-01-14T14:48:38Z | |
| dc.description.abstract | Owing to advanced technologies, the total power density in a high-performance computing system is expected to increase beyond 100 W/cm2; power delivery becomes a critical challenge, and advanced cooling solutions are turning into a necessity. Moreover, reduced noise margin determined by the scaling trend of the technology is making power delivery to the chip ever more challenging. Placing dice side-by-side poses thermal coupling issues where heat flows from the high-power die to the low-power die. There are also inter-dependencies among these different domains. Therefore, in this research effort, we investigate and benchmark different 2.5-D and 3-D heterogeneous integration technologies on the thermal and electrical performance and their inter-dependencies. We develop a thermally aware power delivery network (PDN) design framework to investigate power supply noise for emerging 2.5-D and 3-D integration technologies. We also present a novel backside-PDN configuration where the PDN is separated from the signaling network of the die. The research tasks will feed into one another in order to develop more comprehensive pre-design analysis of heterogeneous integration systems. | |
| dc.description.degree | Ph.D. | |
| dc.format.mimetype | application/pdf | |
| dc.identifier.uri | http://hdl.handle.net/1853/62346 | |
| dc.language.iso | en_US | |
| dc.publisher | Georgia Institute of Technology | |
| dc.subject | Power delivery network | |
| dc.subject | Heterogeneous Integration | |
| dc.title | Power delivery and thermal considerations for 2.5-D and 3-D integration technologies | |
| dc.type | Text | |
| dc.type.genre | Dissertation | |
| dspace.entity.type | Publication | |
| local.contributor.advisor | Bakir, Muhannad S. | |
| local.contributor.corporatename | School of Electrical and Computer Engineering | |
| local.contributor.corporatename | College of Engineering | |
| relation.isAdvisorOfPublication | 752d9ed4-97ec-4a80-9920-4b4d3e762de1 | |
| relation.isOrgUnitOfPublication | 5b7adef2-447c-4270-b9fc-846bd76f80f2 | |
| relation.isOrgUnitOfPublication | 7c022d60-21d5-497c-b552-95e489a06569 | |
| thesis.degree.level | Doctoral |