Title:
Design and development of stress-engineered compliant interconnect in microelectronic packaging
Design and development of stress-engineered compliant interconnect in microelectronic packaging
| dc.contributor.advisor | Sitaraman, Suresh K. | |
| dc.contributor.author | Ma, Lunyu | en_US |
| dc.contributor.department | Mechanical engineering | en_US |
| dc.date.accessioned | 2007-08-10T11:31:12Z | |
| dc.date.available | 2007-08-10T11:31:12Z | |
| dc.date.issued | 2003-08 | en_US |
| dc.description.degree | Ph.D. | en_US |
| dc.identifier.bibid | 674963 | en_US |
| dc.identifier.uri | http://hdl.handle.net/1853/16066 | |
| dc.publisher | Georgia Institute of Technology | en_US |
| dc.rights | Access restricted to authorized Georgia Tech users only. | en_US |
| dc.subject.lcsh | Interconnects (Integrated circuit technology) Design and construction | en_US |
| dc.subject.lcsh | Mircoelectronic packaging | en_US |
| dc.title | Design and development of stress-engineered compliant interconnect in microelectronic packaging | en_US |
| dc.type | Text | |
| dc.type.genre | Dissertation | |
| dspace.entity.type | Publication | |
| local.contributor.advisor | Sitaraman, Suresh K. | |
| local.contributor.corporatename | George W. Woodruff School of Mechanical Engineering | |
| local.contributor.corporatename | College of Engineering | |
| relation.isAdvisorOfPublication | 86701d63-9ca5-4060-89f8-aca6e0b267f6 | |
| relation.isOrgUnitOfPublication | c01ff908-c25f-439b-bf10-a074ed886bb7 | |
| relation.isOrgUnitOfPublication | 7c022d60-21d5-497c-b552-95e489a06569 |
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