Process And Material For Low-cost Flip-chip Solder Interconnect Structures

Title:

Process And Material For Low-cost Flip-chip Solder Interconnect Structures

dc.contributor.patentcreator	Shi, Song-hua
dc.contributor.patentcreator	Wong, Ching-ping
dc.date.accessioned	2017-05-12T14:27:59Z
dc.date.available	2017-05-12T14:27:59Z
dc.date.filed	8/28/2000
dc.date.issued	6/8/2004
dc.description.abstract	The present invention provides a novel process and its required fluxable materials for building low-cost flip-chip interconnect structures. The novel process involves two fluxable materials, fluxable wafer-level compressive-flow underfill material (WLCFU) and fluxable tacky film, and applies these two materials on a wafer level. The two materials can provide sufficient fluxing capability during solder reflow and significant improvement of the fatigue life of the formed solder interconnects after fully cured.
dc.description.assignee	Georgia Tech Research Corp.
dc.identifier.cpc	B23K35/3613
dc.identifier.cpc	H01L21/563
dc.identifier.cpc	H01L24/27
dc.identifier.patentapplicationnumber	09/648777
dc.identifier.patentnumber	6746896
dc.identifier.uri	http://hdl.handle.net/1853/57534
dc.identifier.uspc	438/108
dc.title	Process And Material For Low-cost Flip-chip Solder Interconnect Structures
dc.type	Text
dc.type.genre	Patent
dspace.entity.type	Publication
local.contributor.corporatename	Georgia Institute of Technology
local.relation.ispartofseries	Georgia Tech Patents
relation.isOrgUnitOfPublication	cc30e153-7a64-4ae2-9b1d-5436686785e3
relation.isSeriesOfPublication	0f49c79d-4efb-4bd9-b060-5c7f9191b9da

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