Development of Reworkable Underfill From Hybrid Composite of Free Radical Polymerization System and Epoxy Resin

Wong, C. P.; Fan, Lianhua

Title:

Development of Reworkable Underfill From Hybrid Composite of Free Radical Polymerization System and Epoxy Resin

dc.contributor.author	Wong, C. P.
dc.contributor.author	Fan, Lianhua
dc.date.accessioned	2006-09-01T13:44:58Z
dc.date.available	2006-09-01T13:44:58Z
dc.date.issued	2002-03
dc.description	©2002 IEEE. Personal use of this material is permitted. However, permission to reprint/republish this material for advertising or promotional purposes or for creating new collective works for resale or distribution to servers or lists, or to reuse any copyrighted component of this work in other works must be obtained from the IEEE. This material is presented to ensure timely dissemination of scholarly and technical work. Copyright and all rights therein are retained by authors or by other copyright holders. All persons copying this information are expected to adhere to the terms and constraints invoked by each author's copyright. In most cases, these works may not be reposted without the explicit permission of the copyright holder.	en
dc.description.abstract	The application of the underfill encapsulant is to enhance the solder joint fatigue life in the flip chip assembly, typically up to an order of magnitude, as compared to the nonunderfilled devices. Most of the current underfills, however, are primarily thermosetting epoxy resin curing system based materials, which transform into an infusible three dimensional network structure, and exhibit appreciable adhesion and reliability, but lack of desirable reworkability after curing. From the standpoint of polymeric material chemistry, other thermoplastic or thermosetting polymer materials could be of great economic/cost interest as encapsulants for some microelectronic packaging applications. In this paper, the experimental focus was devoted to the study of adhesion, reliability and reworkability of the free radical polymerization (FRP) system, as well as its hybrid composites or blends with phenoxy resin or epoxy resin (EPR), which could be potential underfill materials. The study encompassed formulation screening based on adhesion measurement, and assessment on reliability and reworkability performance for selected compositions developed so far. Compared with common practice of synthesis of a new epoxy resin backbone or specialty polymer, these FRP/EPR hybrid composites from readily available raw materials would represent a cost effective approach toward reworkable underfill with good adhesion and reliability performance.	en
dc.format.extent	497074 bytes
dc.format.mimetype	application/pdf
dc.identifier.citation	IEEE Transactions on Components and Packaging Technologies, Vol. 25, no. 1, March 2002, 148-155	en
dc.identifier.uri	http://hdl.handle.net/1853/11447
dc.language.iso	en_US	en
dc.publisher	Georgia Institute of Technology	en
dc.publisher.original	Institute of Electrical and Electronics Engineers, Inc., New York
dc.subject	Adhesion	en
dc.subject	Epoxy resin	en
dc.subject	Free radical polymerization	en
dc.subject	Hybrid composite/blend	en
dc.subject	Interpenetrating polymer network	en
dc.subject	Reliability	en
dc.subject	Reworkable/reworkability	en
dc.subject	Underfill	en
dc.title	Development of Reworkable Underfill From Hybrid Composite of Free Radical Polymerization System and Epoxy Resin	en
dc.type	Text
dc.type.genre	Article
dspace.entity.type	Publication
local.contributor.author	Wong, C. P.
local.contributor.corporatename	School of Materials Science and Engineering
local.contributor.corporatename	College of Engineering
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