Title:
Thermally Degradable Epoxy Underfills For Flip-chip Applications

dc.contributor.patentcreator Wang, Lejun
dc.contributor.patentcreator Li, Haiying
dc.contributor.patentcreator Wong, Ching-ping
dc.date.accessioned 2017-05-12T14:27:49Z
dc.date.available 2017-05-12T14:27:49Z
dc.date.filed 3/29/2001
dc.date.issued 12/24/2002
dc.description.abstract A reworkable epoxy underfill is provided for use in an electronic packaged system which incorporates an integrated circuit, an organic printed wire board, and at least one eutectic solder joint formed therebetween. An exemplary embodiment of the encapsulant includes: a cycloaliphatic epoxide; an organic hardener; and a curing accelerator; wherein said cycloaliphatic epoxide includes a carbonate or carbamate group. The encapsulant can also include a filler, such as a silica filler. A method is also provided for forming the aforementioned reworkable epoxy underfills.
dc.description.assignee Georgia Tech Research Corp.
dc.identifier.cpc C07D303/16
dc.identifier.cpc C07D303/36
dc.identifier.cpc H01L24/98
dc.identifier.patentapplicationnumber 09/820549
dc.identifier.patentnumber 6498260
dc.identifier.uri http://hdl.handle.net/1853/57461
dc.identifier.uspc 549/547
dc.title Thermally Degradable Epoxy Underfills For Flip-chip Applications
dc.type Text
dc.type.genre Patent
dspace.entity.type Publication
local.contributor.corporatename Georgia Institute of Technology
local.relation.ispartofseries Georgia Tech Patents
relation.isOrgUnitOfPublication cc30e153-7a64-4ae2-9b1d-5436686785e3
relation.isSeriesOfPublication 0f49c79d-4efb-4bd9-b060-5c7f9191b9da
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