Title:
High performance electrically conductive adhesives (ecas) for leadfree interconnects

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dc.contributor.advisor Wong, C. P.
dc.contributor.author Li, Yi en_US
dc.contributor.committeeMember Jacob, Karl
dc.contributor.committeeMember Liu, Meilin
dc.contributor.committeeMember Milam, Valeria
dc.contributor.committeeMember Wang, Zhong Lin
dc.contributor.department Materials Science and Engineering en_US
dc.date.accessioned 2009-01-22T15:42:22Z
dc.date.available 2009-01-22T15:42:22Z
dc.date.issued 2007-11-02 en_US
dc.description.abstract Electrically conductive adhesives (ECAs) are one of the lead-free interconnect materials with the advantages of environmental friendliness, mild processing conditions, fewer processing steps, low stress on the substrates, and fine pitch interconnect capability. However, some challenging issues still exist for the currently available ECAs, including lower electrical conductivity, conductivity fatigue in reliability tests, limited current-carrying capability, poor impact strength, etc. The interfacial properties is one of the major considerations when resolving these challenges and developing high performance conductive adhesives. Surface functionalization and interface modification are the major approaches used in this thesis. Fundamental understanding and analysis of the interaction between various types of interface modifiers and ECA materials and substrates are the key for the development of high performance ECA for lead-free interconnects. The results of this thesis provide the guideline for the enhancement of interfacial properties of metal-metal and metal-polymer interactions. Systematic investigation of various types of ECAs contributes to a better understanding of materials requirements for different applications, such as surface mount technology (SMT), flip chip applications, flat panel display modules with high resolution, etc. Improvement of the electrical, thermal and reliability of different ECAs make them a potentially ideal candidate for high power and fine pitch microelectronics packaging option. en_US
dc.description.degree Ph.D. en_US
dc.identifier.uri http://hdl.handle.net/1853/26518
dc.publisher Georgia Institute of Technology en_US
dc.subject Adhesives en_US
dc.subject Nanotechnology en_US
dc.subject Electronics materials en_US
dc.subject Self-assembled monolayer en_US
dc.subject.lcsh Interconnects (Integrated circuit technology)
dc.subject.lcsh Lead-free electronics manufacturing processes
dc.subject.lcsh Electric conductivity
dc.subject.lcsh Adhesives Electric properties
dc.title High performance electrically conductive adhesives (ecas) for leadfree interconnects en_US
dc.type Text
dc.type.genre Dissertation
dspace.entity.type Publication
local.contributor.advisor Wong, C. P.
local.contributor.corporatename School of Materials Science and Engineering
local.contributor.corporatename College of Engineering
relation.isAdvisorOfPublication 76540daf-1e96-4626-9ec1-bc8ed1f88e0a
relation.isOrgUnitOfPublication 21b5a45b-0b8a-4b69-a36b-6556f8426a35
relation.isOrgUnitOfPublication 7c022d60-21d5-497c-b552-95e489a06569
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