Thermal Management Devices, Systems, And Methods

Author(s)
Advisor(s)
Editor(s)
Associated Organization(s)
Series
Series
Supplementary to:
Abstract
Briefly described, embodiments of this disclosure include thermal management devices, systems, and methods, convection cooling devices, convection cooling systems, convection cooling methods, hybrid convection/desorption cooling devices, hybrid convection/desorption cooling systems, hybrid convection/desorption cooling methods, are disclosed.
Sponsor
Date
5/12/2009
Extent
Resource Type
Text
Resource Subtype
Patent
Rights Statement
Rights URI