New Materials & Printing Processes for Flexible Electronics

Frisbie, Daniel

Title:

New Materials & Printing Processes for Flexible Electronics

dc.contributor.author	Frisbie, Daniel
dc.contributor.corporatename	Georgia Institute of Technology. School of Chemical and Biomolecular Engineering	en_US
dc.contributor.corporatename	University of Minnesota	en_US
dc.date.accessioned	2015-09-11T16:18:20Z
dc.date.available	2015-09-11T16:18:20Z
dc.date.issued	2015-09-02
dc.description	Presented on September 2, 2015 from 4-5 pm in room G011 of the Molecular Science and Engineering Building on the Georgia Tech campus.	en_US
dc.description	Runtime: 56:52 minutes
dc.description.abstract	Currently there is great interest in developing manufacturing methods for integrating electronic circuitry into flexible and stretchable substrates for a spectrum of applications including roll‐up displays, wearable biosensors, smart labels, and electronic skins (‘e‐skins’) for robotics, for example. One fabrication strategy that has captured imaginations involves the use of digital or analog printing techniques to pattern electronically functional inks onto paper, plastic, rubber, or metal foils. However, “printed electronics” has a number of significant challenges, including spatial resolution, pattern registration, and printed circuit performance. In this talk, I will describe a multi‐pronged approach to address these challenges that may bring roll‐to‐roll printed electronics closer to reality. To begin, I will show that innovations in materials allow the fabrication of printable, low voltage thin film transistors (TFTs), the key building blocks of flexible circuits, and that these can be incorporated into simple printed circuit demonstrations involving two dozen TFTs and an equivalent number of printed resistors and capacitors. The second half of the talk will describe a novel liquid‐based fabrication approach that we term SCALE, or Self‐Aligned Capillarity‐Assisted Lithography for Electronics. The SCALE process employs a combination of digital printing and in‐substrate capillary flow to produce self‐aligned devices with feature sizes that are currently as small as 1 m. The talk will finish with a discussion of the new opportunities in flexible microelectronics afforded by liquid‐based processing.	en_US
dc.embargo.terms	null	en_US
dc.format.extent	56:52 minutes
dc.identifier.uri	http://hdl.handle.net/1853/53818
dc.language.iso	en_US	en_US
dc.publisher	Georgia Institute of Technology	en_US
dc.relation.ispartofseries	School of Chemical and Biomolecular Engineering Seminar Series	en_US
dc.relation.ispartofseries	School of Chemical and Biomolecular Engineering Seminar Series
dc.subject	Capacitors	en_US
dc.subject	Flexible electronics	en_US
dc.subject	Lithography	en_US
dc.title	New Materials & Printing Processes for Flexible Electronics	en_US
dc.type	Moving Image
dc.type.genre	Lecture
dspace.entity.type	Publication
local.contributor.corporatename	School of Chemical and Biomolecular Engineering
local.contributor.corporatename	College of Engineering
local.relation.ispartofseries	School of Chemical and Biomolecular Engineering Seminar Series
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relation.isSeriesOfPublication	388050f3-0f40-4192-9168-e4b7de4367b4