3D and 2.5D microfabrication technologies for high-density electronic heterogeneous integration and biosensing applications

dc.contributor.advisor Bakir, Muhannad S.
dc.contributor.author Zia, Muneeb
dc.contributor.committeeMember Brand, Oliver
dc.contributor.committeeMember Wang, Hua
dc.contributor.committeeMember Inan, Omer
dc.contributor.committeeMember Sober, Samuel J.
dc.contributor.department Electrical and Computer Engineering
dc.date.accessioned 2019-01-16T17:24:55Z
dc.date.available 2019-01-16T17:24:55Z
dc.date.created 2018-12
dc.date.issued 2018-11-09
dc.date.submitted December 2018
dc.date.updated 2019-01-16T17:24:55Z
dc.description.abstract The demand for continuous increase in computing performance has put an overburdening demand on I/O interface and novel heterogeneous integration to allow performance benefits at system level. The demand for high-density integration is not limited to computing systems but, with ever increase use of electronics in biological science space, extends to in vitro and in vivo biosensing systems as well. In this research, 3D and 2.5D microfabrication technologies for advancing heterogeneous integration and biosensing systems are presented. Technology enablers for realizing large-scale silicon systems as well as unique fabrication allowing 3D solenoidal micro-inductors alongside flexible interconnects are discussed in the first half of the thesis. The fabrication technology utilizes photoresist reflow process to obtain dome-shaped structures to serve as the basis for the flexible interconnects, self-alignment structures and 3D solenoidal micro-inductors. The fabrication technology discussed in Chapter 3 also gives control over the height, thickness, material and pitch of the fabricated flexible interconnects. This allows for close integration of disparate ICs along with micro-inductors. The same fabrication process is then adapted and applied to in vitro and in vivo biosensing domain; through-silicon-vias and flexible interconnects are used to fabricate an electronic microplate platform for low-cost high-throughput biosensing. Furthermore, the reflow process is further utilized to fabricate 3D multi-electrode arrays on flexible substrate for high SNR EMG recordings from songbird.
dc.description.degree Ph.D.
dc.format.mimetype application/pdf
dc.identifier.uri http://hdl.handle.net/1853/60795
dc.language.iso en_US
dc.publisher Georgia Institute of Technology
dc.subject 3D integration
dc.subject 2.5D integration
dc.subject Heterogeneous integration
dc.subject Flexible interconnects
dc.subject In vitro biosensing
dc.subject In vivo biosensing
dc.subject EMG
dc.subject Songbird
dc.subject Flexible multi-electrode array
dc.title 3D and 2.5D microfabrication technologies for high-density electronic heterogeneous integration and biosensing applications
dc.type Text
dc.type.genre Dissertation
dspace.entity.type Publication
local.contributor.advisor Bakir, Muhannad S.
local.contributor.corporatename School of Electrical and Computer Engineering
local.contributor.corporatename College of Engineering
relation.isAdvisorOfPublication 752d9ed4-97ec-4a80-9920-4b4d3e762de1
relation.isOrgUnitOfPublication 5b7adef2-447c-4270-b9fc-846bd76f80f2
relation.isOrgUnitOfPublication 7c022d60-21d5-497c-b552-95e489a06569
thesis.degree.level Doctoral
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