Title:
Hardness assurance testing and radiation hardening by design techniques for silicon-germanium heterojunction bipolar transistors and digital logic circuits

dc.contributor.advisor Cressler, John D.
dc.contributor.author Sutton, Akil Khamisi en_US
dc.contributor.committeeMember Deo, Chaitanya
dc.contributor.committeeMember Doolittle, Alan
dc.contributor.committeeMember Keezer, David
dc.contributor.committeeMember May, Gary
dc.contributor.committeeMember Papapolymerou, John
dc.contributor.department Electrical and Computer Engineering en_US
dc.date.accessioned 2009-08-26T18:18:33Z
dc.date.available 2009-08-26T18:18:33Z
dc.date.issued 2009-05-04 en_US
dc.description.abstract Hydrocarbon exploration, global navigation satellite systems, computed tomography, and aircraft avionics are just a few examples of applications that require system operation at an ambient temperature, pressure, or radiation level outside the range covered by military specifications. The electronics employed in these applications are known as "extreme environment electronics." On account of the increased cost resulting from both process modifications and the use of exotic substrate materials, only a handful of semiconductor foundries have specialized in the production of extreme environment electronics. Protection of these electronic systems in an extreme environment may be attained by encapsulating sensitive circuits in a controlled environment, which provides isolation from the hostile ambient, often at a significant cost and performance penalty. In a significant departure from this traditional approach, system designers have begun to use commercial off-the-shelf technology platforms with built in mitigation techniques for extreme environment applications. Such an approach simultaneously leverages the state of the art in technology performance with significant savings in project cost. Silicon-germanium is one such commercial technology platform that demonstrates potential for deployment into extreme environment applications as a result of its excellent performance at cryogenic temperatures, remarkable tolerance to radiation-induced degradation, and monolithic integration with silicon-based manufacturing. In this dissertation the radiation response of silicon-germanium technology is investigated, and novel transistor-level layout-based techniques are implemented to improve the radiation tolerance of HBT digital logic. en_US
dc.description.degree Ph.D. en_US
dc.identifier.uri http://hdl.handle.net/1853/29778
dc.publisher Georgia Institute of Technology en_US
dc.subject Bit error rate testing en_US
dc.subject Displacement damage en_US
dc.subject Heterojunction bipolar transistor en_US
dc.subject Radiation effects en_US
dc.subject Radiation hardening by design en_US
dc.subject Silicon germanium en_US
dc.subject Single event upset en_US
dc.subject Ionization en_US
dc.subject.lcsh Heterojunctions
dc.subject.lcsh Bipolar transistors
dc.subject.lcsh Logic circuits
dc.subject.lcsh Radiation hardening
dc.subject.lcsh Hardness
dc.subject.lcsh Germanium compounds
dc.subject.lcsh Silicon compounds
dc.subject.lcsh Extreme environments
dc.title Hardness assurance testing and radiation hardening by design techniques for silicon-germanium heterojunction bipolar transistors and digital logic circuits en_US
dc.type Text
dc.type.genre Dissertation
dspace.entity.type Publication
local.contributor.advisor Cressler, John D.
local.contributor.corporatename School of Electrical and Computer Engineering
local.contributor.corporatename College of Engineering
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relation.isOrgUnitOfPublication 7c022d60-21d5-497c-b552-95e489a06569
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