Title:
Moisture Absorption in Uncured Underfill Materials
Moisture Absorption in Uncured Underfill Materials
dc.contributor.author | Wong, C. P. | |
dc.contributor.author | Luo, Shijian | |
dc.date.accessioned | 2006-09-01T19:33:39Z | |
dc.date.available | 2006-09-01T19:33:39Z | |
dc.date.issued | 2004-06 | |
dc.description | ©2004 IEEE. Personal use of this material is permitted. However, permission to reprint/republish this material for advertising or promotional purposes or for creating new collective works for resale or distribution to servers or lists, or to reuse any copyrighted component of this work in other works must be obtained from the IEEE. This material is presented to ensure timely dissemination of scholarly and technical work. Copyright and all rights therein are retained by authors or by other copyright holders. All persons copying this information are expected to adhere to the terms and constraints invoked by each author's copyright. In most cases, these works may not be reposted without the explicit permission of the copyright holder. | en |
dc.description.abstract | This paper presents a systematic study on moisture absorption in uncured underfill based on epoxy cured with acid anhydride [methylhexahydrophthalic anhydride (MHHPA)] and epoxy cured with non-acid anhydride curing agent. The influence of absorbed moisture on curing properties, thermomechanical property, and adhesion property of underfill after curing has been investigated. For epoxy cured with non-acid anhydride, the moisture absorption is low, and the absorbed moisture has no significant effect on the properties of cured underfill materials. For epoxy cured with acid anhydride, the moisture absorption before curing can be more than 2.0%, and the absorbed moisture can affect the properties significantly. The absorbed moisture can catalyze the curing reaction between acid anhydride and epoxy. The glass transition temperature of the cured samples is reduced after the underfill absorbs the moisture before curing. The adhesion strength decreases dramatically after the underfill absorbs the moisture before curing. | en |
dc.format.extent | 298702 bytes | |
dc.format.mimetype | application/pdf | |
dc.identifier.citation | IEEE Transactions on Components and Packaging Technologies, Vol. 27, no. 2, June 2004, 345-351 | en |
dc.identifier.uri | http://hdl.handle.net/1853/11563 | |
dc.language.iso | en_US | en |
dc.publisher | Georgia Institute of Technology | en |
dc.publisher.original | Institute of Electrical and Electronics Engineers, Inc., New York | |
dc.subject | Adhesion | en |
dc.subject | Epoxy | en |
dc.subject | Moisture absorption | en |
dc.subject | Underfill | en |
dc.title | Moisture Absorption in Uncured Underfill Materials | en |
dc.type | Text | |
dc.type.genre | Article | |
dspace.entity.type | Publication | |
local.contributor.author | Wong, C. P. | |
local.contributor.corporatename | School of Materials Science and Engineering | |
local.contributor.corporatename | College of Engineering | |
relation.isAuthorOfPublication | 76540daf-1e96-4626-9ec1-bc8ed1f88e0a | |
relation.isOrgUnitOfPublication | 21b5a45b-0b8a-4b69-a36b-6556f8426a35 | |
relation.isOrgUnitOfPublication | 7c022d60-21d5-497c-b552-95e489a06569 |