Title:
Through-package-via (TPV) Structures On Inorganic Interposer And Methods For Fabricating Same
Through-package-via (TPV) Structures On Inorganic Interposer And Methods For Fabricating Same
| dc.contributor.patentcreator | Sundaram, Venkatesh | |
| dc.contributor.patentcreator | Liu, Fuhan | |
| dc.contributor.patentcreator | Tummala, Rao | |
| dc.contributor.patentcreator | Sukumaran, Vijay | |
| dc.contributor.patentcreator | Sridharan, Vivek | |
| dc.contributor.patentcreator | Chen, Qiao | |
| dc.date.accessioned | 2017-05-12T14:26:47Z | |
| dc.date.available | 2017-05-12T14:26:47Z | |
| dc.date.filed | 3/3/2011 | |
| dc.date.issued | 3/1/2016 | |
| dc.description.abstract | Aspects of the present disclosure generally relate to a microelectronic package including a plurality of through vias having walls in a glass interposer having a top portion and a bottom portion. The microelectric package may also include a stress relief barrier on at least a portion of the top and bottom portions of the glass interposer. The microelectric package may further include a metallization seed layer on at least a portion of the stress relief layer and a conductor on at least a portion of the metallization seed layer. The conductor extends through at least a portion of the plurality of the through vias, forming a plurality of metalized through package vias. At least a portion of the through vias are filled with the stress relief layer or the metallization seed layer. | |
| dc.description.assignee | Georgia Tech Research Corporation | |
| dc.identifier.cpc | H01L21/486 | |
| dc.identifier.cpc | H01L23/15 | |
| dc.identifier.cpc | H01L23/49827 | |
| dc.identifier.patentapplicationnumber | 13/582453 | |
| dc.identifier.patentnumber | 9275934 | |
| dc.identifier.uri | http://hdl.handle.net/1853/57055 | |
| dc.identifier.uspc | 1-Jan | |
| dc.title | Through-package-via (TPV) Structures On Inorganic Interposer And Methods For Fabricating Same | |
| dc.type | Text | |
| dc.type.genre | Patent | |
| dspace.entity.type | Publication | |
| local.contributor.corporatename | Georgia Institute of Technology | |
| local.relation.ispartofseries | Georgia Tech Patents | |
| relation.isOrgUnitOfPublication | cc30e153-7a64-4ae2-9b1d-5436686785e3 | |
| relation.isSeriesOfPublication | 0f49c79d-4efb-4bd9-b060-5c7f9191b9da |
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