Title:
Global Routing for Three Dimensional Packaging
Global Routing for Three Dimensional Packaging
Author(s)
Minz, Jacob Rajkumar
Lim, Sung Kyu
Lim, Sung Kyu
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Abstract
Three dimensional packaging is becoming a popular concept because of the numerous advantages it has to offer over the existing conventional technologies. System on Packages (SOP) is an example of three dimensional packaging. The contribution of this work is threefold: (i) formulation of the new 3-dimensional global routing problem, (ii) a new routing flow that considers the various design constraints unique to SOP, and (iii) a global router for the technology. Our related experimental results demonstrate the effectiveness of our algorithm.
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Date Issued
2003
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224378 bytes
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Text
Resource Subtype
Technical Report