Title:
Research and technology deployment in electronics assembly
Research and technology deployment in electronics assembly
| dc.contributor.author | McGinnis, Leon F. | |
| dc.contributor.corporatename | Georgia Institute of Technology. Office of Sponsored Programs | en_US |
| dc.contributor.corporatename | Georgia Institute of Technology. School of Industrial and Systems Engineering | en_US |
| dc.date.accessioned | 2016-05-31T14:32:42Z | |
| dc.date.available | 2016-05-31T14:32:42Z | |
| dc.date.issued | 1994-06 | |
| dc.description | Issued as Final report, Project no. E-24-X55 | en_US |
| dc.description | Final report has title: Benchmarking printed circuit card assembly. | |
| dc.embargo.terms | null | en_US |
| dc.identifier | e-24-x55 | |
| dc.identifier.uri | http://hdl.handle.net/1853/55081 | |
| dc.language.iso | en_US | en_US |
| dc.publisher | Georgia Institute of Technology | en_US |
| dc.relation.ispartofseries | School of Industrial and Systems Engineering ; Project no. E-24-X55 | en_US |
| dc.subject.lcsh | Assembly-line methods | |
| dc.subject.lcsh | Electronic apparatus and appliances | |
| dc.title | Research and technology deployment in electronics assembly | en_US |
| dc.title.alternative | Benchmarking printed circuit card assembly | |
| dc.type | Text | |
| dc.type.genre | Technical Report | |
| dspace.entity.type | Publication | |
| local.contributor.author | McGinnis, Leon F. | |
| local.contributor.corporatename | H. Milton Stewart School of Industrial and Systems Engineering | |
| local.contributor.corporatename | College of Engineering | |
| local.contributor.corporatename | Office of Sponsored Programs | |
| local.relation.ispartofseries | OSP Final Research Reports | |
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