Title:
Methods For Fabricating Three-dimensional All Organic Interconnect Structures

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dc.contributor.patentcreator White, George E.
dc.contributor.patentcreator Swaminathan, Madhavan
dc.contributor.patentcreator Sundaram, Venkatesh
dc.contributor.patentcreator Dalmia, Sidharth
dc.date.accessioned 2017-05-12T14:28:24Z
dc.date.available 2017-05-12T14:28:24Z
dc.date.filed 3/28/2003
dc.date.issued 8/28/2007
dc.description.abstract The present invention includes methods for making liquid crystalline polymer (LCP) interconnect structures using a high temperature and low temperature single sided liquid crystalline polymer LCP where both the high and low temperature LCP are drilled to form a z-axis connection. The single sided conductive layer is a bus layer to form z axis conductive stud within the high and low temperature LCP, followed by a metallic capping layer of the stud that serves as the bonding metal between the conductive interconnects to form the z-axis connection. High and low temperature LCP layers are etched or built up to form circuit patterns and subsequently bonded together to form final multilayer circuit pattern where the low temperature LCP melts to form both dielectric to dielectric bond to high temperature LCP circuit layer, and dielectric to conductive bond, whereas metal to metal bonding occurs with high temperature metal capping layer bonding to conductive metal layer.
dc.description.assignee Georgia Tech Research Corporation
dc.identifier.cpc H01L21/4857
dc.identifier.cpc H01L25/0652
dc.identifier.cpc H01L27/08
dc.identifier.patentapplicationnumber 10/402315
dc.identifier.patentnumber 7260890
dc.identifier.uri http://hdl.handle.net/1853/57700
dc.identifier.uspc 29/830
dc.title Methods For Fabricating Three-dimensional All Organic Interconnect Structures
dc.type Text
dc.type.genre Patent
dspace.entity.type Publication
local.contributor.corporatename Georgia Institute of Technology
local.relation.ispartofseries Georgia Tech Patents
relation.isOrgUnitOfPublication cc30e153-7a64-4ae2-9b1d-5436686785e3
relation.isSeriesOfPublication 0f49c79d-4efb-4bd9-b060-5c7f9191b9da
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