Title:
Methods For Fabricating Three-dimensional All Organic Interconnect Structures
Methods For Fabricating Three-dimensional All Organic Interconnect Structures
Files
Author(s)
Advisor(s)
Editor(s)
Collections
Supplementary to
Permanent Link
Abstract
The present invention includes methods for making liquid crystalline polymer (LCP) interconnect structures using a high temperature and low temperature single sided liquid crystalline polymer LCP where both the high and low temperature LCP are drilled to form a z-axis connection. The single sided conductive layer is a bus layer to form z axis conductive stud within the high and low temperature LCP, followed by a metallic capping layer of the stud that serves as the bonding metal between the conductive interconnects to form the z-axis connection. High and low temperature LCP layers are etched or built up to form circuit patterns and subsequently bonded together to form final multilayer circuit pattern where the low temperature LCP melts to form both dielectric to dielectric bond to high temperature LCP circuit layer, and dielectric to conductive bond, whereas metal to metal bonding occurs with high temperature metal capping layer bonding to conductive metal layer.
Sponsor
Date Issued
8/28/2007
Extent
Resource Type
Text
Resource Subtype
Patent