Title:
Electro-kinetically enhanced nano-metric material removal
Electro-kinetically enhanced nano-metric material removal
| dc.contributor.advisor | Danyluk, Steven | |
| dc.contributor.author | Blackburn, Travis Lee | en_US |
| dc.contributor.committeeMember | Butler, David | |
| dc.contributor.committeeMember | Hesketh, Peter | |
| dc.contributor.committeeMember | Yoda, Minami | |
| dc.contributor.department | Mechanical Engineering | en_US |
| dc.date.accessioned | 2009-01-22T15:49:17Z | |
| dc.date.available | 2009-01-22T15:49:17Z | |
| dc.date.issued | 2008-08-25 | en_US |
| dc.description.abstract | This project is a fundamental proof of concept to look at the feasibility of using field activated abrasive particles to achieve material removal on a substrate. There are a few different goals for this project. The first goal is to prove through visualization that particle movement can be influenced and controlled by changes in electric field. The second goal is to fundamentally prove that particles controlled by electric field can remove material from a substrate. Third, it should be shown that changes in electric field can control the amount of material being removed in a given amount of time. A mathematical model will be presented which predicts metallic material removal rates based on changes in electric field strength. In this project, a technique combining concepts from electrokinetics, electrochemical mechanical planarization, and contact mechanics is proposed, aiming at enhancing planarization performance. By introducing an AC electric field with a DC offset, we try to achieve not only a better control of metallic material removal but also more flexible manipulation of the dynamic behaviour of abrasive particles. The presence of electric field will lead to electrokinetic phenomena including electroosmotic flow of an electrolyte solution and electrophoretic motion of abrasive particles. As a result, we aim to improve both the mechanical performance of planarization that is largely determined by the polishing parameters (e.g. down pressure, rotation speed, pads, and types of abrasives) and the chemical performance of planarization that is governed by selective and collective reactions of different chemical ingrediants of the slurry with the sample surface. The aim is also to understand and improve the interactions of abrasive particles with the sample. | en_US |
| dc.description.degree | M.S. | en_US |
| dc.identifier.uri | http://hdl.handle.net/1853/26600 | |
| dc.publisher | Georgia Institute of Technology | en_US |
| dc.subject | Ultra-precision metallic material removal | en_US |
| dc.subject.lcsh | Chemical mechanical planarization | |
| dc.subject.lcsh | Miniature electronic equipment | |
| dc.subject.lcsh | Electrochemical cutting | |
| dc.subject.lcsh | Grinding and polishing | |
| dc.subject.lcsh | Semiconductors | |
| dc.title | Electro-kinetically enhanced nano-metric material removal | en_US |
| dc.type | Text | |
| dc.type.genre | Thesis | |
| dspace.entity.type | Publication | |
| local.contributor.advisor | Danyluk, Steven | |
| local.contributor.corporatename | George W. Woodruff School of Mechanical Engineering | |
| local.contributor.corporatename | College of Engineering | |
| relation.isAdvisorOfPublication | 87cdff3a-1d95-4b3b-97f3-fa686905084b | |
| relation.isOrgUnitOfPublication | c01ff908-c25f-439b-bf10-a074ed886bb7 | |
| relation.isOrgUnitOfPublication | 7c022d60-21d5-497c-b552-95e489a06569 |
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