Title:
Enhanced thermal conductivity of liquid encapsulants for electronic packaging
Enhanced thermal conductivity of liquid encapsulants for electronic packaging
| dc.contributor.advisor | Wong, C. P. | |
| dc.contributor.author | Bollampally, Raja Sheker | en_US |
| dc.contributor.department | Materials science and engineering | |
| dc.contributor.department | Polymers | |
| dc.date.accessioned | 2008-02-21T12:31:48Z | |
| dc.date.available | 2008-02-21T12:31:48Z | |
| dc.date.issued | 1998-12 | en_US |
| dc.description.degree | M.S. | en_US |
| dc.identifier.bibid | 485465 | en_US |
| dc.identifier.uri | http://hdl.handle.net/1853/19974 | |
| dc.publisher | Georgia Institute of Technology | en_US |
| dc.rights | Access restricted to authorized Georgia Tech users only. | en_US |
| dc.subject.lcsh | Electronic packaging | en_US |
| dc.subject.lcsh | Heat Conduction | en_US |
| dc.subject.lcsh | Electronic apparatus and appliances Plastic embedment | en_US |
| dc.title | Enhanced thermal conductivity of liquid encapsulants for electronic packaging | en_US |
| dc.type | Text | |
| dc.type.genre | Thesis | |
| dspace.entity.type | Publication | |
| local.contributor.advisor | Wong, C. P. | |
| local.contributor.corporatename | School of Materials Science and Engineering | |
| local.contributor.corporatename | College of Engineering | |
| relation.isAdvisorOfPublication | 76540daf-1e96-4626-9ec1-bc8ed1f88e0a | |
| relation.isOrgUnitOfPublication | 21b5a45b-0b8a-4b69-a36b-6556f8426a35 | |
| relation.isOrgUnitOfPublication | 7c022d60-21d5-497c-b552-95e489a06569 |
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