Title:
Inspection System And Method For Bond Detection And Validation Of Surface Mount Devices

dc.contributor.patentcreator Vachtsevanos, George J.
dc.contributor.patentcreator Dar, Iqbal M.
dc.contributor.patentcreator Newman, Kimberly E.
dc.contributor.patentcreator Sahinci, Erin
dc.date.accessioned 2017-05-12T14:27:28Z
dc.date.available 2017-05-12T14:27:28Z
dc.date.filed 11/20/1996
dc.date.issued 10/5/1999
dc.description.abstract A hybrid surface mount component inspection system which includes both vision and infrared inspection techniques to determine the presence of surface mount components on a printed wiring board, and the quality of solder joints of surface mount components on printed wiring boards by using data level sensor fusion to combine data from two infrared sensors to obtain emissivity independent thermal signatures of solder joints, and using feature level sensor fusion with active perception to assemble and process inspection information from any number of sensors to determine characteristic feature sets of different defect classes to classify solder defects.
dc.description.assignee Georgia Tech Research Corporation
dc.identifier.cpc G01N21/88
dc.identifier.cpc G01N21/95684
dc.identifier.cpc G01N25/72
dc.identifier.patentapplicationnumber 08/753181
dc.identifier.patentnumber 5963662
dc.identifier.uri http://hdl.handle.net/1853/57311
dc.identifier.uspc 382/150
dc.title Inspection System And Method For Bond Detection And Validation Of Surface Mount Devices
dc.type Text
dc.type.genre Patent
dspace.entity.type Publication
local.contributor.corporatename Georgia Institute of Technology
local.relation.ispartofseries Georgia Tech Patents
relation.isOrgUnitOfPublication cc30e153-7a64-4ae2-9b1d-5436686785e3
relation.isSeriesOfPublication 0f49c79d-4efb-4bd9-b060-5c7f9191b9da
Files
Original bundle
Now showing 1 - 1 of 1
Thumbnail Image
Name:
5963662.pdf
Size:
1.46 MB
Format:
Adobe Portable Document Format
Description: