Title:
Method Of Fabricating A Module, For Millimeter Wave Multi-gigabit Wireless Systems

Simple item page
dc.contributor.patentcreator Pinel, Stephane
dc.contributor.patentcreator Laskar, Joy
dc.date.accessioned 2017-05-12T14:29:21Z
dc.date.available 2017-05-12T14:29:21Z
dc.date.filed 1/4/2011
dc.date.issued 10/16/2012
dc.description.abstract A method of fabricating an ultra-high frequency module is disclosed. The method includes providing a top layer; drilling the top layer; milling the top layer; providing a bottom; milling the bottom layer to define a bottom layer cavity; aligning the top layer and the bottom layer; and adhering the top layer to the bottom layer. The present invention also includes an ultra-high frequency module operating at ultra-high speeds having a top layer, the top layer defining a top layer cavity; a bottom layer, the bottom layer defining a bottom layer cavity; and an adhesive adhering both the top layer to the bottom layer, wherein the top layer and the bottom layer are formed from a large area panel of a printed circuit board.
dc.description.assignee Georgia Tech Research Corporation
dc.identifier.cpc H01P1/20327
dc.identifier.cpc H01P1/2039
dc.identifier.cpc H01P11/007
dc.identifier.patentapplicationnumber 12/984035
dc.identifier.patentnumber 8286328
dc.identifier.uri http://hdl.handle.net/1853/58084
dc.identifier.uspc 29/592.1
dc.title Method Of Fabricating A Module, For Millimeter Wave Multi-gigabit Wireless Systems
dc.type Text
dc.type.genre Patent
dspace.entity.type Publication
local.contributor.corporatename Georgia Institute of Technology
local.relation.ispartofseries Georgia Tech Patents
relation.isOrgUnitOfPublication cc30e153-7a64-4ae2-9b1d-5436686785e3
relation.isSeriesOfPublication 0f49c79d-4efb-4bd9-b060-5c7f9191b9da
Files
Original bundle
Now showing 1 - 1 of 1
Thumbnail Image
Name:
8286328.pdf
Size:
934.58 KB
Format:
Adobe Portable Document Format
Description:
Download
Collections
Research Publications