Title:
Microjet cooling devices for thermal management of electronics
Microjet cooling devices for thermal management of electronics
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Author(s)
Kercher, Dan S.
Lee, Jeong-Bong
Brand, Oliver
Allen, Mark G.
Glezer, Ari
Lee, Jeong-Bong
Brand, Oliver
Allen, Mark G.
Glezer, Ari
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Abstract
This research is an effort to demonstrate the applicability
of miniaturized synthetic jet (microjet) technology to the area
of thermal management of microelectronic devices. Synthetic jets
are jets which are formed from entrainment and expulsion of the
fluid in which they are embedded. Design issues of microjet cooling
devices are discussed along with characterization of excitation elements
and the turbulent synthetic jets produced thereby. Geometrical
parameters of the microjet cooling devices were empirically
optimized with regards to cooling performance. The cooling performance
of the optimized microjets was compared with previous
theoretical and empirical studies of conventional jet impingement.
The cooling performance of the microjet devices has been investigated
in an open environment as well as in a vented and closed
case environment. In such experiments, the synthetic jet impinges
normal to the surface of a packaged thermal test die, comprising
a heater and a diode-based temperature sensor. This test assembly
allows simultaneous heat generation and temperature sensing of
the package, thereby enabling assessment of the performance of the
synthetic jet. Using microjet cooling devices, a thermal resistance
of 30.1 °C/W has been achieved (when unforced cooling is used,
thermal resistance is 59.6 °C/W) when the test chip is located at
15 mm spacing from the jet exit plane. In order to more directly
compare and scale the cooling results, a preliminary study on heat
transfer correlations of the microjet cooling device has been performed.
Finally, a comparison of the performance of the microjet
cooler with standard cooling fans is given.
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Date Issued
2003-06
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Article