Title:
Processes For Lift-off Of Thin Film Materials Or Devices For Fabricating Three Dimensional Integrated Circuits, Optical Detectors, And Micromechanical Devices

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Abstract
Various novel lift-off and bonding processes (60, 80, 100) permit lift-off of thin film materials and devices (68), comprising Inx Ga1-x Asy P1-y where 0
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3/28/1995
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