Title:
The design of SiGe integrated circuit components for extreme environment systems and sensors

dc.contributor.advisor Cressler, John D.
dc.contributor.author Diestelhorst, Ryan Matthew
dc.contributor.committeeMember Ralph, Stephen
dc.contributor.committeeMember Papapolymerou, John
dc.contributor.committeeMember Steffes, Paul
dc.contributor.committeeMember Wang, Chris K.
dc.contributor.department Electrical and Computer Engineering
dc.date.accessioned 2014-01-13T16:21:12Z
dc.date.available 2014-01-13T16:21:12Z
dc.date.created 2013-12
dc.date.issued 2013-08-22
dc.date.submitted December 2013
dc.date.updated 2014-01-13T16:21:12Z
dc.description.abstract A background investigation of the total-dose radiation tolerance of a third generation complementary SiGe:C BiCMOS technology platform was performed. Tolerance was quantified under proton and X-ray radiation sources for both the npn and pnp HBT, as well as for an operational amplifier built with these devices. Furthermore, a technique known as junction isolation radiation hardening was proposed and tested with the goal of improving the SEE sensitivity of the npn by reducing the charge collected by the subcollector in the event of a direct ion strike. Three independent systems were designed, including: 1) a charge amplification channel developed as part of a remote electronics unit for the lunar environment, 2) variable bias circuitry for a self-healing radar receiver, and 3) an ultra-fast x-ray detector for picosecond scale time-domain measurements of evolving chemical reactions. The first two projects capitalized on the wide-temperature performance and radiation tolerance of the SiGe HBT, allowing them to operate under extreme environmental conditions reliably and consistently. The third design makes use of the high-frequency capabilities of the HBT, particularly in emitter-coupled logic (ECL) configurations. Findings concerning the performance of these systems and implications for future research are discussed.
dc.description.degree Ph.D.
dc.format.mimetype application/pdf
dc.identifier.uri http://hdl.handle.net/1853/50262
dc.language.iso en_US
dc.publisher Georgia Institute of Technology
dc.subject Silicon-germanium
dc.subject SiGe
dc.subject Extreme environment
dc.subject Wide-temperature
dc.subject Radiation
dc.subject.lcsh Extreme environments
dc.subject.lcsh Bipolar integrated circuits
dc.subject.lcsh Metal oxide semiconductors, Complementary.
dc.title The design of SiGe integrated circuit components for extreme environment systems and sensors
dc.type Text
dc.type.genre Dissertation
dspace.entity.type Publication
local.contributor.advisor Cressler, John D.
local.contributor.corporatename School of Electrical and Computer Engineering
local.contributor.corporatename College of Engineering
relation.isAdvisorOfPublication 2df1dcb5-f1ce-4e65-a1eb-021f8a8ab8bc
relation.isOrgUnitOfPublication 5b7adef2-447c-4270-b9fc-846bd76f80f2
relation.isOrgUnitOfPublication 7c022d60-21d5-497c-b552-95e489a06569
thesis.degree.level Doctoral
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