Title:
Methods Of Forming Micromechanical Resonators Having High Density Trench Arrays Therein That Provide Passive Temperature Compensation
Methods Of Forming Micromechanical Resonators Having High Density Trench Arrays Therein That Provide Passive Temperature Compensation
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Abstract
A method of forming a micromechanical resonator includes forming a resonator body anchored to a substrate by at least a first anchor. This resonator body may include a semiconductor or other first material having a negative temperature coefficient of elasticity (TCE). A two-dimensional array of spaced-apart trenches are provided in the resonator body. These trenches may be filled with an electrically insulating or other second material having a positive TCE. The array of trenches may extend uniformly across the resonator body, including regions in the body that have relatively high and low mechanical stress during resonance. This two-dimensional array (or network) of trenches can be modeled as a network of mass-spring systems with springs in parallel and/or in series with respect to a direction of a traveling acoustic wave within the resonator body during resonance.
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2/26/2013
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Patent