Title:
Study of thermally reworkable epoxy materials and thermal conductivity enhancement using carbon fiber for electronics packaging
Study of thermally reworkable epoxy materials and thermal conductivity enhancement using carbon fiber for electronics packaging
| dc.contributor.advisor | Wong, C. P. | |
| dc.contributor.author | Li, Haiying | en_US |
| dc.contributor.department | Polymer, Textile and Fiber Engineering | en_US |
| dc.date.accessioned | 2005-03-10T18:28:37Z | |
| dc.date.available | 2005-03-10T18:28:37Z | |
| dc.date.issued | 2003-12-01 | en_US |
| dc.description.degree | Ph.D. | en_US |
| dc.format.extent | 5239186 bytes | |
| dc.format.mimetype | application/pdf | |
| dc.identifier.uri | http://hdl.handle.net/1853/5342 | |
| dc.language.iso | en_US | |
| dc.publisher | Georgia Institute of Technology | en_US |
| dc.subject | Electronic packaging Materials | en_US |
| dc.subject | Epoxy resins | |
| dc.subject | Electric conductivity | |
| dc.title | Study of thermally reworkable epoxy materials and thermal conductivity enhancement using carbon fiber for electronics packaging | en_US |
| dc.type | Text | |
| dc.type.genre | Dissertation | |
| dspace.entity.type | Publication | |
| local.contributor.advisor | Wong, C. P. | |
| local.contributor.corporatename | School of Materials Science and Engineering | |
| local.contributor.corporatename | College of Engineering | |
| relation.isAdvisorOfPublication | 76540daf-1e96-4626-9ec1-bc8ed1f88e0a | |
| relation.isOrgUnitOfPublication | 21b5a45b-0b8a-4b69-a36b-6556f8426a35 | |
| relation.isOrgUnitOfPublication | 7c022d60-21d5-497c-b552-95e489a06569 |
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