Title:
Study of thermally reworkable epoxy materials and thermal conductivity enhancement using carbon fiber for electronics packaging
Study of thermally reworkable epoxy materials and thermal conductivity enhancement using carbon fiber for electronics packaging
Author(s)
Li, Haiying
Advisor(s)
Wong, C. P.
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Date Issued
2003-12-01
Extent
5239186 bytes
Resource Type
Text
Resource Subtype
Dissertation