Title:
Conductivity Mechanisms of Isotropic Conductive Adhesives (ICA’s)
Conductivity Mechanisms of Isotropic Conductive Adhesives (ICA’s)
| dc.contributor.author | Wong, C. P. | |
| dc.contributor.author | Lu, Daoqiang | |
| dc.contributor.author | Tong, Quinn K. | |
| dc.date.accessioned | 2006-09-06T14:55:43Z | |
| dc.date.available | 2006-09-06T14:55:43Z | |
| dc.date.issued | 1999-07 | |
| dc.description | ©1999 IEEE. Personal use of this material is permitted. However, permission to reprint/republish this material for advertising or promotional purposes or for creating new collective works for resale or distribution to servers or lists, or to reuse any copyrighted component of this work in other works must be obtained from the IEEE. This material is presented to ensure timely dissemination of scholarly and technical work. Copyright and all rights therein are retained by authors or by other copyright holders. All persons copying this information are expected to adhere to the terms and constraints invoked by each author's copyright. In most cases, these works may not be reposted without the explicit permission of the copyright holder. | en |
| dc.description.abstract | Isotropic conductive adhesives (ICA’s) are usually composites of adhesive resins with conductive fillers (mainly silver flakes). The adhesive pastes before cure usually have low electrical conductivity. The conductive adhesives become highly conductive only after the adhesives are cured and solidified. The mechanisms of conductivity achievement in conductive adhesives were discussed. Experiments were carefully designed in order to determine the roles of adhesive shrinkage and silver (Ag) flake lubricant removal on adhesive conductivity achievement during cure. The conductivity establishment of the selected adhesive pastes and the cure shrinkage of the corresponding adhesive resins during cure were studied. Then conductivity developments of some metallic fillers and ICA pastes with external pressures were studied by using a specially designed test device. In addition, conductivity, resin cure shrinkage, and Ag flake lubricant behavior of an ICA which was cured at room temperature (25 ℃) were investigated. Based on the results, it was found that cure shrinkage of the resin, rather than lubricant removal, was the prerequisite for conductivity development of conductive adhesives. In addition, an explanation of how cure shrinkage could cause conductivity achievement of conductive adhesives during cure was proposed in this paper. | en |
| dc.format.extent | 106733 bytes | |
| dc.format.mimetype | application/pdf | |
| dc.identifier.citation | IEEE transactions on electronics packaging manufacturing, Vol. 22, no. 3, July 1999, 223-227 | en |
| dc.identifier.uri | http://hdl.handle.net/1853/11662 | |
| dc.language.iso | en_US | en |
| dc.publisher | Georgia Institute of Technology | en |
| dc.publisher.original | Institute of Electrical and Electronics Engineers, Inc., New York | |
| dc.subject | Conductivity establishment | en |
| dc.subject | Mechanism | en |
| dc.subject | Shrinkage | en |
| dc.subject | Isotropic conductive adhesives | en |
| dc.title | Conductivity Mechanisms of Isotropic Conductive Adhesives (ICA’s) | en |
| dc.type | Text | |
| dc.type.genre | Article | |
| dspace.entity.type | Publication | |
| local.contributor.author | Wong, C. P. | |
| local.contributor.corporatename | School of Materials Science and Engineering | |
| local.contributor.corporatename | College of Engineering | |
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