Title:
Low cost next generation flip chip assembly process development
Low cost next generation flip chip assembly process development
| dc.contributor.author | Baldwin, Daniel F. | en_US |
| dc.contributor.corporatename | Georgia Institute of Technology. School of Mechanical Engineering | en_US |
| dc.contributor.corporatename | Georgia Institute of Technology. Office of Sponsored Programs | |
| dc.contributor.corporatename | Georgia Institute of Technology. Office of Sponsored Programs | |
| dc.date.accessioned | 2006-05-11T15:14:00Z | |
| dc.date.available | 2006-05-11T15:14:00Z | |
| dc.date.issued | 1998 | en_US |
| dc.description | Issued as final report | en_US |
| dc.format.extent | 4468475 bytes | |
| dc.format.mimetype | application/pdf | |
| dc.identifier.uri | http://hdl.handle.net/1853/9558 | |
| dc.language.iso | en_US | |
| dc.publisher | Georgia Institute of Technology | en_US |
| dc.relation.ispartofseries | School of Mechanical Engineering; Project no. E-25-A80 | en_US |
| dc.subject | Electronic circuits Design and testing | en_US |
| dc.subject | Microelectronic packaging | en_US |
| dc.title | Low cost next generation flip chip assembly process development | en_US |
| dc.type | Text | |
| dc.type.genre | Technical Report | |
| dspace.entity.type | Publication | |
| local.contributor.corporatename | George W. Woodruff School of Mechanical Engineering | |
| local.contributor.corporatename | Office of Sponsored Programs | |
| local.contributor.corporatename | College of Engineering | |
| local.relation.ispartofseries | OSP Final Research Reports | |
| relation.isOrgUnitOfPublication | c01ff908-c25f-439b-bf10-a074ed886bb7 | |
| relation.isOrgUnitOfPublication | c315e181-6c1e-4968-b8cf-a66220b5bcf2 | |
| relation.isOrgUnitOfPublication | 7c022d60-21d5-497c-b552-95e489a06569 | |
| relation.isSeriesOfPublication | 628bc9a1-6779-42aa-aa38-1dcd6fcd12ca |
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