Title:
Sintered nanoporous copper die-attach interconnections: Syntheis and characterization

dc.contributor.advisor Tummala, Rao R.
dc.contributor.advisor Smet, Vanessa
dc.contributor.advisor Antoniou, Antonia
dc.contributor.author Mohan, Kashyap
dc.contributor.committeeMember Singh, Preet
dc.contributor.committeeMember Thadhani, Naresh
dc.contributor.department Materials Science and Engineering
dc.date.accessioned 2020-09-04T18:41:42Z
dc.date.available 2020-09-04T18:41:42Z
dc.date.created 2020-08
dc.date.issued 2020-08-06
dc.date.submitted August 2020
dc.date.updated 2020-09-04T18:41:42Z
dc.description.abstract To address the demand for higher electrification and efficiency in automobiles and aviation, there is an increasing focus on developing new power electronics packaging technologies which can enable the wide-bandgap devices to operate at their full potential. In particular, new die-attach interconnection materials are needed with thermal stability at temperatures greater than 250°C, superior thermal and electrical conductivities for higher thermal dissipation and power handling. In this thesis, low-temperature, low-pressure sintering of nanoporous copper (Cu) films to form all-Cu die-attach joints is proposed as the next-generation die-attach technology capable of addressing the above-mentioned challenges. To realize the above objectives, two research tasks were identified and demonstrated. In the first task, fabrication o nanoporous Cu by chemical dealloying of amorphous Cu alloy ribbons and electroplated Cu-Zn films was explored. Fundamental relationships between the Cu-Zn electroplating parameters, composition of the electroplated films, morphology of the dealloyed films, and residual Zn after dealloying were established. Based on the results, guidelines were also framed for large-scale fabrication of nanoporous Cu films. In the second task, the effect of the sintering temperatures and sintering atmospheres on the sintering kinetics of nanoporous Cu film was explored, followed by the development of assembly parameters to enable good metallurgical bonding between nanoporous Cu and Cu metallizations. The initial assembly trials gave promising results and Cu-Cu joints with shear strengths>40MPa were achieved.
dc.description.degree Ph.D.
dc.format.mimetype application/pdf
dc.identifier.uri http://hdl.handle.net/1853/63479
dc.language.iso en_US
dc.publisher Georgia Institute of Technology
dc.subject Copper interconnections
dc.subject Nanoporous copper
dc.subject Film sintering
dc.title Sintered nanoporous copper die-attach interconnections: Syntheis and characterization
dc.type Text
dc.type.genre Dissertation
dspace.entity.type Publication
local.contributor.advisor Antoniou, Antonia
local.contributor.advisor Tummala, Rao R.
local.contributor.corporatename School of Materials Science and Engineering
local.contributor.corporatename College of Engineering
relation.isAdvisorOfPublication 522a0555-dbbb-4e12-bfcf-ee83d6874a39
relation.isAdvisorOfPublication fe05ddb2-e957-4584-ac88-58a197df62aa
relation.isOrgUnitOfPublication 21b5a45b-0b8a-4b69-a36b-6556f8426a35
relation.isOrgUnitOfPublication 7c022d60-21d5-497c-b552-95e489a06569
thesis.degree.level Doctoral
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