Title:
Development of a Low Temperature Silver Paste for High Efficiency Screen-Printed Solar Cells

dc.contributor.author Ebong, Abasifreke
dc.contributor.author Zhang, W.
dc.contributor.author Bokalo, P.
dc.contributor.author Rohatgi, Ajeet
dc.contributor.corporatename Georgia Institute of Technology. School of Electrical and Computer Engineering
dc.contributor.corporatename Heraeus Incorporated. Thick Film Materials Division
dc.contributor.corporatename Georgia Institute of Technology. University Center of Excellence for Photovoltaic Research and Education
dc.date.accessioned 2008-12-08T20:57:42Z
dc.date.available 2008-12-08T20:57:42Z
dc.date.issued 2006-09
dc.description Presented at the 21st European Photovoltaic Solar Energy Conference and Exhibition; Dresden, Germany; September 4-8, 2006. en
dc.description.abstract The screen-printing technology provides a low cost high-throughput approach to good contacts for silicon solar cells. However, currently screen-printed contacts are formed at the expense of slight performance and fill factor loss. The front grid contact is particularly important and requires low contact resistance, high shunt resistance, and low junction recombination for high fill factor. Often contacts are fired in the moderate to high temperature range (750-800 degrees C) to achieve low series resistance. However, high temperature firing can lead to junction shunting and recombination, which degrades fill factor. Moreover shallow or higher sheet resistance emitters (50-100 Ω/sq) are desirable for high performance, which makes devices even more vulnerable to high temperature firing. Therefore, in this study, we modify the paste composition by adding some dopants and additives to lower the peak firing temperature for good ohmic contacts. This also reduces the wafer bowing and enhances SiN-induced defect hydrogenation in multicrystalline silicon substrates. The results show that increasing the additives concentration lowered the optimum firing temperature from 780 to 720 degrees C. In addition, the ideality factor is reduced significantly at the lower firing temperature. Thus additives used in this study were able to lower the peak firing temperature and increase the fill factor without hurting the series resistance. Fill factor of 0.774 on textured CZ was obtained at ~720 degrees C peak firing temperature for paste G (SOL9807). These pastes were formulated at Heraeus. Heraeus paste formulation differs in the nature and the amount of additives in the pastes. en
dc.identifier.uri http://hdl.handle.net/1853/25916
dc.language.iso en_US en
dc.publisher Georgia Institute of Technology en
dc.subject Screen-printed solar cells en
dc.subject Low temperature Ag paste en
dc.subject Heraeus en
dc.subject Solar cells
dc.title Development of a Low Temperature Silver Paste for High Efficiency Screen-Printed Solar Cells en
dc.type Text
dc.type.genre Proceedings
dspace.entity.type Publication
local.contributor.author Rohatgi, Ajeet
local.contributor.corporatename School of Electrical and Computer Engineering
local.contributor.corporatename College of Engineering
local.contributor.corporatename University Center of Excellence for Photovoltaics
relation.isAuthorOfPublication b7cc3b55-ebc6-42fd-b859-107fb271b10d
relation.isOrgUnitOfPublication 5b7adef2-447c-4270-b9fc-846bd76f80f2
relation.isOrgUnitOfPublication 7c022d60-21d5-497c-b552-95e489a06569
relation.isOrgUnitOfPublication 93ace8d3-7479-459e-b63d-27aff6118464
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