Interconnect Design and System Integration For 3D RF Reconfigurable Structures in Communications Applications
Author(s)
Wille, Nathan David
Advisor(s)
Editor(s)
Collections
Supplementary to:
Permanent Link
Abstract
3D packaging is broadening horizons for radio frequency (RF) electronic systems. In wireless sensor networks, 3D packaging can be used to reduce the form factor of wireless sensor nodes. Additive manufacturing is the desired means of fabrication for these wireless sensor nodes due to its low cost and suitability for custom designs. In addition to being small and low-cost, these wireless sensor nodes must also be fully passive to enhance network scalability, making RF energy harvesting the best means for powering these devices. A low form factor, additively manufactured energy harvester is developed for integration with a wireless sensor node. This design can produce a 3V output, and integration with an existing wireless sensor node is demonstrated. 3D foldable structures present unique capabilities for millimeter-wave (mmWave) systems, where mechanical beamsteering through folding can be utilized to enhance angle coverage and beamsteering precision. A foldable structure requires custom actuation mechanisms to achieve folding motions, as well as foldable interconnects that can span folding hinges. A custom mechanical actuation system is created for the 3D foldable eggbox structure that is both lightweight and low power. Three foldable interconnect designs are developed: an additively manufactured interconnect fabricated on a Flexible 80A substrate that exhibits limited foldability and quickly degrading mechanical performance, an additively manufactured interconnect fabricated on a PET substrate that maintains continuity for at least 500 folding cycles and consistent electrical performance for 200 folding cycles, and a printed interconnect fabricated on a Rogers 3003 substrate that uses an arch interconnect design to maintain continuity for at least 200 folding cycles and constant electrical performance until failure.
Sponsor
Date
2024-04-29
Extent
Resource Type
Text
Resource Subtype
Thesis