Title:
Materials and Processes for High Conversion Ratio High Efficiency Package Embedded Inductors for Integrated Voltage Regulators
Materials and Processes for High Conversion Ratio High Efficiency Package Embedded Inductors for Integrated Voltage Regulators
Author(s)
Murali, Prahalad
Advisor(s)
Swaminathan, Madhavan
Losego, Mark D.
Losego, Mark D.
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Abstract
This thesis delves into the evolving landscape of datacenter applications, where the demand for faster and denser chiplets mandates a re-evaluation of power delivery strategies. Conventional practices of converging all input voltages to 1 V on the PCB have reached their limits due to large packages and escalating power density requirements. This challenge is exacerbated by the increasing transistor density per mm2 facilitated by cutting-edge nodes and 3D stacking of chiplets. Consequently, the industry is shifting towards higher input voltages to reduce current, necessitating the integration of a single stage of power conversion within the chiplet package.
Integral to this integration is the use of IVR chiplets, specifically Gallium Nitride (GaN), for voltages exceeding 5 V. GaN's wide bandgap, compared to silicon-based MOSFETs, presents a promising avenue for achieving efficiency targets. However, this transition demands innovative inductor designs and materials to ensure optimal system efficiency under stringent requirements.
The research objectives encompass understanding the impact of metal filler shape and heat treatment on inductor properties, fabricating and comparing toroidal and spiral inductors, reliability assessment, and integrating inductors in close proximity to chiplets. Cutting-edge models, materials, and processes are employed to unravel the structure-property correlation of metal fillers in metal-polymer composites for high-conversion-ratio applications. The study also demonstrates and compares the efficacy of toroidal and stacked spiral inductor designs, evaluating their reliability under demanding operational conditions. Lastly, it showcases a Redistribution Layer (RDL) embedded inductor spanning multiple buildup layers, pushing the boundaries of inductor integration for optimal system efficiency.
This thesis contributes valuable insights and practical solutions to the burgeoning field of high-voltage power delivery in datacenter applications. By addressing critical gaps in understanding and presenting innovations, it sets the stage for more efficient and sustainable computing architectures.
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Date Issued
2023-12-12
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Resource Type
Text
Resource Subtype
Dissertation