Title:
Micromechanics-based interfacial stress analysis and fracture in electronic packaging assemblies with heterogeneous underfill
Micromechanics-based interfacial stress analysis and fracture in electronic packaging assemblies with heterogeneous underfill
Author(s)
Park, Ji Eun
Advisor(s)
Jasiuk, Iwona
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Abstract
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Date Issued
2001-08
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Resource Type
Text
Resource Subtype
Dissertation
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Access restricted to authorized Georgia Tech users only.