Micromechanics-based interfacial stress analysis and fracture in electronic packaging assemblies with heterogeneous underfill
Author(s)
Park, Ji Eun
Advisor(s)
Jasiuk, Iwona
Editor(s)
Collections
Supplementary to:
Permanent Link
Abstract
Sponsor
Date
2001-08
Extent
Resource Type
Text
Resource Subtype
Dissertation
Rights Statement
Access restricted to authorized Georgia Tech users only.