Title:
Chip-level waveguide-mirror-pillar optical interconnect structure
Chip-level waveguide-mirror-pillar optical interconnect structure
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Author(s)
Ogunsola, O. O.
Thacker, H. D.
Bachim, B. L.
Bakir, Muhannad S.
Pikarsky, J.
Gaylord, Thomas K.
Meindl, J. D.
Thacker, H. D.
Bachim, B. L.
Bakir, Muhannad S.
Pikarsky, J.
Gaylord, Thomas K.
Meindl, J. D.
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Abstract
Waveguides, mirrors, and polymer pillars can be integrated together to provide optical interconnects to the chip level. Total internal reflection in the polymer pillar provides a high level of spatial confinement of the light. The metallized mirror terminating the waveguide may be at 45 or at a nearby angle such as 54.74 (anisotropically etched silicon) and produce nearly equal coupling efficiencies. For a polymer waveguide, a gold mirror, and a polymer pillar of the dimensions fabricated, the simulated coupling efficiencies are 80.7% or 0.93 dB (45 mirror) and 82.5% or 0.84 dB (54.74 mirror), respectively. These simulations together with the fabrication and testing of a 54.74 mirror configuration demonstrates the viability of the waveguide-mirror-pillar structure, its insensitivity to mirror angle, and its compatibility with current substrate fabrication technologies.
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Date Issued
2006-07
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