Title:
Design of Baluns and Low Noise Amplifiers in Integrated Mixed-Signal Organic Substrates

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dc.contributor.advisor Swaminathan, Madhavan
dc.contributor.author Govind, Vinu en_US
dc.contributor.committeeMember Abhijit Chatterjee
dc.contributor.committeeMember James S. Kenney
dc.contributor.committeeMember Rao R. Tummala
dc.contributor.committeeMember Suresh K. Sitaraman
dc.contributor.department Electrical and Computer Engineering en_US
dc.date.accessioned 2005-09-16T15:11:40Z
dc.date.available 2005-09-16T15:11:40Z
dc.date.issued 2005-07-19 en_US
dc.description.abstract The integration of mixed-signal systems has long been a problem in the semiconductor industry. CMOS System-on-Chip (SOC), the traditional means for integration, fails mixed-signal systems on two fronts; the lack of on-chip passives with high quality (Q) factors inhibits the design of completely integrated wireless circuits, and the noise coupling from digital to analog circuitry through the conductive silicon substrate degrades the performance of the analog circuits. Advancements in semiconductor packaging have resulted in a second option for integration, the System-On-Package (SOP) approach. Unlike SOC where the package exists just for the thermal and mechanical protection of the ICs, SOP provides for an increase in the functionality of the IC package by supporting multiple chips and embedded passives. However, integration at the package level also comes with its set of hurdles, with significant research required in areas like design of circuits using embedded passives and isolation of noise between analog and digital sub-systems. A novel multiband balun topology has been developed, providing concurrent operation at multiple frequency bands. The design of compact wideband baluns has been proposed as an extension of this theory. As proof-of-concept devices, both singleband and wideband baluns have been fabricated on Liquid Crystalline Polymer (LCP) based organic substrates. A novel passive-Q based optimization methodology has been developed for chip-package co-design of CMOS Low Noise Amplifiers (LNA). To implement these LNAs in a mixed-signal environment, a novel Electromagnetic Band Gap (EBG) based isolation scheme has also been employed. The key contributions of this work are thus the development of novel RF circuit topologies utilizing embedded passives, and an advancement in the understanding and suppression of signal coupling mechanisms in mixed-signal SOP-based systems. The former will result in compact and highly integrated solutions for RF front-ends, while the latter is expected to have a significant impact in the integration of these communication devices with high performance computing. en_US
dc.description.degree Ph.D. en_US
dc.format.extent 2223376 bytes
dc.format.mimetype application/pdf
dc.identifier.uri http://hdl.handle.net/1853/7208
dc.language.iso en_US
dc.publisher Georgia Institute of Technology en_US
dc.subject Electromagnetic Band Gap (EBG) en_US
dc.subject Balun
dc.subject Liquid Crystalline Polymer (LCP)
dc.subject System-on-Package (SOP)
dc.subject Mixed-signal
dc.subject Low Noise Amplifier (LNA)
dc.subject Embedded passives
dc.title Design of Baluns and Low Noise Amplifiers in Integrated Mixed-Signal Organic Substrates en_US
dc.type Text
dc.type.genre Dissertation
dspace.entity.type Publication
local.contributor.advisor Swaminathan, Madhavan
local.contributor.corporatename School of Electrical and Computer Engineering
local.contributor.corporatename College of Engineering
relation.isAdvisorOfPublication 974f4642-b132-43e2-9ca6-c40e8af82f93
relation.isOrgUnitOfPublication 5b7adef2-447c-4270-b9fc-846bd76f80f2
relation.isOrgUnitOfPublication 7c022d60-21d5-497c-b552-95e489a06569
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