Evaluation and process development of wafer-level-applied underfill material systems for flip chip assembly
Author(s)
Busch, Stephen Christopher
Advisor(s)
Baldwin, Daniel F.
Editor(s)
Collections
Supplementary to:
Permanent Link
Abstract
Sponsor
Date
2001-05
Extent
Resource Type
Text
Resource Subtype
Thesis
Rights Statement
Access restricted to authorized Georgia Tech users only.