Title:
Study of warpage of base substrates and materials for large-area MCM-D packaging
Study of warpage of base substrates and materials for large-area MCM-D packaging
Author(s)
Dang, Anh Xuan-Hung
Advisor(s)
Ume, I. Charles
Editor(s)
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Abstract
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Date Issued
1999-12
Extent
Resource Type
Text
Resource Subtype
Thesis
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Access restricted to authorized Georgia Tech users only.