Title:
Damage metric-based thermal cycling guidelines for area-array packages used in harsh thermal conditions
Damage metric-based thermal cycling guidelines for area-array packages used in harsh thermal conditions
dc.contributor.advisor | Sitaraman, Suresh K. | |
dc.contributor.author | Pyland, James | en_US |
dc.contributor.department | Mechanical engineering | en_US |
dc.date.accessioned | 2007-12-20T12:30:52Z | |
dc.date.available | 2007-12-20T12:30:52Z | |
dc.date.issued | 2002-05 | en_US |
dc.description.degree | M.S. | en_US |
dc.identifier.bibid | 629523 | en_US |
dc.identifier.uri | http://hdl.handle.net/1853/18851 | |
dc.publisher | Georgia Institute of Technology | en_US |
dc.rights | Access restricted to authorized Georgia Tech users only. | en_US |
dc.subject.lcsh | Electronic packaging Reliability | en_US |
dc.subject.lcsh | Solder and soldering Reliability | en_US |
dc.subject.lcsh | Solder and soldering Thermal fatigue | en_US |
dc.subject.lcsh | Electronic packaging Thermal fatigue | en_US |
dc.title | Damage metric-based thermal cycling guidelines for area-array packages used in harsh thermal conditions | en_US |
dc.type | Text | |
dc.type.genre | Thesis | |
dspace.entity.type | Publication | |
local.contributor.advisor | Sitaraman, Suresh K. | |
local.contributor.corporatename | George W. Woodruff School of Mechanical Engineering | |
local.contributor.corporatename | College of Engineering | |
relation.isAdvisorOfPublication | 86701d63-9ca5-4060-89f8-aca6e0b267f6 | |
relation.isOrgUnitOfPublication | c01ff908-c25f-439b-bf10-a074ed886bb7 | |
relation.isOrgUnitOfPublication | 7c022d60-21d5-497c-b552-95e489a06569 |
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