Title:
MODELING, DESIGN, FABRICATION AND DEMONSTRATION OF ULTRA-THIN, HIGH- PERFORMANCE GLASS PANEL EMBEDDED (GPE) PACKAGES FOR MM-WAVE APPLICATIONS
MODELING, DESIGN, FABRICATION AND DEMONSTRATION OF ULTRA-THIN, HIGH- PERFORMANCE GLASS PANEL EMBEDDED (GPE) PACKAGES FOR MM-WAVE APPLICATIONS
| dc.contributor.advisor | Tummala, Rao R. | |
| dc.contributor.author | Shi, Tailong | |
| dc.contributor.committeeMember | Swaminathan, Madhavan | |
| dc.contributor.committeeMember | Peterson, Andrew F. | |
| dc.contributor.committeeMember | Kathaperumal, Mohanalingam | |
| dc.contributor.committeeMember | Vogel, Eric | |
| dc.contributor.department | Electrical and Computer Engineering | |
| dc.date.accessioned | 2021-01-11T17:14:43Z | |
| dc.date.available | 2021-01-11T17:14:43Z | |
| dc.date.created | 2020-12 | |
| dc.date.issued | 2020-12-08 | |
| dc.date.submitted | December 2020 | |
| dc.date.updated | 2021-01-11T17:14:43Z | |
| dc.description.abstract | The objective of the proposed research is to model, design, fabricate and demonstrate ultra-thin, highperformance ultra-thin glass panel embedded package (GPE) for mm-Wave applications. Ultra-thin lowwarpage and low die-shift GPE packages were first time demonstrated with thickness less than 150 μm applying advanced low-cost large panel based double side carrier process. Low-loss interconnects were modeled and designed with interconnection loss below 0.2 dB at 77 GHz enabled by ultra-low loss RDL dielectric, and optimized high precision processes for via drilling and photolithography with minimal variations in line and via geometries on glass substrates. A die-package codesign was proposed for highfrequency characterization of ultra-thin GPE package for mm-Wave applications. GPE packages with low system insertion loss (-0.6 dB @ 77 GHz) & low noise figure (2.9 dB @ 77 GHz) were demonstrated, enabled by chip-package co-design and GPE architecture. | |
| dc.description.degree | Ph.D. | |
| dc.format.mimetype | application/pdf | |
| dc.identifier.uri | http://hdl.handle.net/1853/64217 | |
| dc.language.iso | en_US | |
| dc.publisher | Georgia Institute of Technology | |
| dc.subject | ultra-thin | |
| dc.subject | Glass Panel Embedding (GPE) | |
| dc.title | MODELING, DESIGN, FABRICATION AND DEMONSTRATION OF ULTRA-THIN, HIGH- PERFORMANCE GLASS PANEL EMBEDDED (GPE) PACKAGES FOR MM-WAVE APPLICATIONS | |
| dc.type | Text | |
| dc.type.genre | Dissertation | |
| dspace.entity.type | Publication | |
| local.contributor.advisor | Tummala, Rao R. | |
| local.contributor.corporatename | School of Electrical and Computer Engineering | |
| local.contributor.corporatename | College of Engineering | |
| relation.isAdvisorOfPublication | fe05ddb2-e957-4584-ac88-58a197df62aa | |
| relation.isOrgUnitOfPublication | 5b7adef2-447c-4270-b9fc-846bd76f80f2 | |
| relation.isOrgUnitOfPublication | 7c022d60-21d5-497c-b552-95e489a06569 | |
| thesis.degree.level | Doctoral |