MODELING, DESIGN, FABRICATION AND DEMONSTRATION OF ULTRA-THIN, HIGH- PERFORMANCE GLASS PANEL EMBEDDED (GPE) PACKAGES FOR MM-WAVE APPLICATIONS
Author(s)
Shi, Tailong
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Abstract
The objective of the proposed research is to model, design, fabricate and demonstrate ultra-thin, highperformance
ultra-thin glass panel embedded package (GPE) for mm-Wave applications. Ultra-thin lowwarpage
and low die-shift GPE packages were first time demonstrated with thickness less than 150 μm
applying advanced low-cost large panel based double side carrier process. Low-loss interconnects were
modeled and designed with interconnection loss below 0.2 dB at 77 GHz enabled by ultra-low loss RDL
dielectric, and optimized high precision processes for via drilling and photolithography with minimal
variations in line and via geometries on glass substrates. A die-package codesign was proposed for highfrequency
characterization of ultra-thin GPE package for mm-Wave applications. GPE packages with low
system insertion loss (-0.6 dB @ 77 GHz) & low noise figure (2.9 dB @ 77 GHz) were demonstrated,
enabled by chip-package co-design and GPE architecture.
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Date
2020-12-08
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Text
Resource Subtype
Dissertation