Title:
Method For Selective Deposition Of Materials In Micromachined Molds

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Abstract
Methods for creating one or more structures in a micromachined device. In one arrangement, the methods include the steps of providing a substrate, forming upstanding nonconductive mold walls on the substrate so that first and second wells are formed, the second well being wider than the first well. The method further includes applying a first material to the surface of the wells so that the first well fills with the first material before the second well, and removing the first material from the second well while leaving a portion in the first well.
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5/20/2003
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Patent
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