Title:
Thermo-mechanical reliability of the VSPA package solder joints

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murphy_r_s_199712_ms_456216.pdf (19.69 MB)
Author(s)
Murphy, R. Sean
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Advisor(s)
Sitaraman, Suresh K.
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http://hdl.handle.net/1853/17119
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1997-12
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Thesis
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