A Novel Heterogeneously Integrated Photonic Platform for Optical Interconnects
Author(s)
Vangapandu, Sai Rakesh Moha Rakesh
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Abstract
Silicon has been the widely used material for integrated photonics due to the availability of the advanced
foundry infrastructure. Recently, silicon carbide (SiC) and lithium niobate (LN) have been widely
investigated for chip-scale photonics, bringing owing to their unique photonic properties spanning across
classical and quantum applications. Compared to silicon, these materials offer wide transparency and high speed electro-optic effect which is necessary to address the energy-speed barrier in computing. In this
research, I present a novel hybrid material platform enabled for the first time, through heterogenous
integration of SiC and LN. While heterogenous integration through wafer bonding is a well-known process
in photonics, especially for laser integration, we need to overcome the thermal expansion challenge of
materials. I will discuss - 1) the process flow for developing the hybrid SiC-LN, 2) photonic device
fabrication, and the 3) demonstration of electro-optic phase shift. This will be followed by the discussion
of CMOS-photonics, and on-package interconnects – which is the state-of-the art technology used in
industry with Si, silicon nitride, and glass materials. Here, I discuss my research accomplishments in the
fabrication of microheaters for reconfigurability, and the development of an on-package optical
interconnects. The novel material platform demonstrated here will signal new device architectures spanning
across classical and quantum computing applications
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Date
2023-12-15
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Text
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Dissertation